CB 453215


  • High density packaging with a pitch of 2.54 mm(0.1 inch)max. is possible. This series requires less space and has greater EMI suppression effects.
    •  Different types with the same shape are available.
    •  Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
    •  Applicable to both flow and reflow soldering.
    •  High impedance cover wide frequency ranges.
    •  L material type can minimize attenuation of the signal waveform due to its sharp impedance

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