CB 160808


  • High density packaging with a pitch of 2.54 mm(0.1 inch)max. is possible. This series requires less space and has greater EMI suppression effects.
    􀂻 Different types with the same shape are available.
    􀂻 Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
    􀂻 Applicable to both flow and reflow soldering.
    􀂻 High impedance cover wide frequency ranges.
    􀂻 L material type can minimize attenuation of the signal waveform due to its sharp impedance

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